1.体积小巧,占地1㎡ 2.多种点胶头应对不同场景 3.全数字化监控软件;
♦ 底部填充 Underfill ♦ 引脚包封 Pin encapsulation ♦ 精密涂覆 Precision coating ♦ 堆栈封装POP Stack Package POP ♦ 围坝填充 Dam filling ♦ SMT红胶制程 SMT red glue process ♦ COB封装 COB package ♦ 热熔胶粘接 Hot melt adhesive bonding ♦ FPC元器件补强 FPC component reinforcement;